Zabi na manufaLaser source: Edobations baLasiconctors LaserBangare biyu
4. Matsayin Aikace-aikacen Bashi
Saboda babbar kewayon yumbu da babban iko, gaba-itting hassers na semiconductor an samu nasarar amfani da wasu lamunin semiconductor a cikin fannoni da yawa kamar mota.Lasermagani. A cewar cile ci gaba, wani kamfanin bincike na duniya sanannen kasuwar Laser na kasa da kasa zai kera kasuwar dala biliyan 7.4 a cikin 2027, tare da fili girma na shekara-shekara na 13%. Wannan ci gaban zai ci gaba da zama ta hanyar sadarwa na gani, kamar kayayyaki na gani, masu wadatarwa, da aikace-aikacen na 3D don sadarwa na bayanai da sadarwa. Don buƙatun aikace-aikace daban-daban, an inganta tsarin tsarin ƙirar daban-daban a cikin masana'antar, ciki har da: laft) Lasercor Laser (FP) Laseronductor Laser (DFB Laser), Quanintum Cascade Lasiconductor (QCL), da kuma yanki mai kifaye na laser (Bald).
Tare da karuwar bukatar sadarwa, aikace-aikacen na 3D da sauran filayen, bukatar neman lasertorcor din yana ƙaruwa. Bugu da kari, gefen-itting hesiconducorcor da vertical-rami mai-da-itpting emempondu suma taka rawa wajen cika kasawar junan su, kamar:
(1) A fagen sadarwa na gani, da 1550 nm Ingsaasp / INP Laser) Distancesan wasan 200 na Ingilishi da yawa, VCSels ya dogara da 850 nm Ingeraas da algaas sun mallaki.
(2) Lorers tsaye a tsaye Lasers Lacants suna da fa'idodi na karamin girma da kuma kunkuntar raƙuman lantarki, don haka ana amfani da su a cikin aikace-aikacen masu amfani da masu amfani da su da kuma aiki mai nisa.
(3) Dukansu-itar-itfting Lasemun Lasemun da ke tsaye-tsaye-itsi za a iya amfani da su na timponductor na sliconductor don cimma takamaiman aikace-aikacen da kuma tashi taho.
5. Ci gaban gaba
A gefen yana haifar da semiconductor Laseronductors yana da fa'idodin babban abin dogaro, miniacitization mai yawan wutar lantarki, kuma yana da babban mawuyacin aikace-shirye a cikin sadarwa, lidar, likita da sauran filayen. Koyaya, ko da yake cewa tsarin masana'antu na gefen laseran wasan kwaikwayo na Semicondtuctor din ya girma, wanda ya zama dole a ci gaba da inganta hanyoyin tattaunawa, ciki har da: rage girman rauni a cikin Wafer; Rage hanyoyin aiwatar da tsari; Haɓaka sabbin fasahar su maye gurbin dabarun gargajiya da kuma wanke wafer matakai waɗanda ke iya gabatar da lahani; Inganta tsarin epitaxail don inganta ingancin mai amfani da lasisi; Rage farashi na masana'antu, da sauransu.
Lokaci: Jan - 22-2024